gp30a thru gp30m vishay semiconductors formerly general semiconductor document number 88640 www.vishay.com 16-dec-02 1 reverse voltage 50 to 1000v forward current 3.0a glass passivated junction plastic rectifiers maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol gp30a gp30b gp30d GP30G gp30j gp30k gp30m unit maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current 0.375" (9.5mm) lead length at t a = 55? i f(av) 3.0 a peak forward surge current 8.3ms single half sine-wave i fsm 125 a superimposed on rated load (jedec method) maximum full load reverse current, full cycle average 0.375" (9.5mm) lead length at t a = 55? i r(av) 100 a typical thermal resistance (1) r ja 20 r jl 10 ?/w operating junction and storage temperature range t j , t stg 65 to +175 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol gp30a gp30b gp30d GP30G gp30j gp30k gp30m unit maximum instantaneous forward voltage at 3.0a v f 1.2 1.1 v maximum reverse current t a = 25? 5.0 at rated dc blocking voltage t a = 125? i r 100 a maximum reverse recovery time i f = 0.5a, i r = 1.0v, i rr = 0.25a t rr 5.0 s typical junction capacitance at 4.0v, 1mhz c j 40 pf note: (1) thermal resistance from junction to ambient and from junction to lead at 0.375 (9.5mm) lead length, p.c.b. mounted do-201ad features ?plastic package has underwriters laboratories flammability classification 94v-0 ?high temperature metallurgically bonded construction ?cavity-free glass passivated junction ?capable of meeting environmental standards of mil-s-19500 3.0 ampere operation at t a =55? with no thermal runaway ?typical i r less than 0.1 a high temperature soldering guaranteed: 350?/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: jedec do-201ad, molded plastic over glass body terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.04oz., 1.12g 0.210 (5.3) 0.190 (4.8) dia. 0.052 (1.32) 0.048 (1.22) dia. 1.0 (25.4) min. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) min. * glass-plastic encapsulation technique is covered by patent no. 3,996,602 and brazed-lead assembly by patent no. 3,930,306 dimensions in inches and (millimeters) patented*
gp30a thru gp30m vishay semiconductors formerly general semiconductor www.vishay.com document number 88640 2 16-dec-02 ratings and characteristic curves (t a = 25 c unless otherwise noted) 0 25 50 100 75 125 150 175 0 1.0 2.0 3.0 4.0 1 10 100 10 100 200 0.6 0.8 0.9 0.7 1.0 1.1 1.2 1.3 10 100 1 0.1 1 10 100 10 100 0 20 40 60 80 100 0.01 0.1 1 10 average forward rectified current (a) peak forward surge current (a) fig 3 ?typical instantaneous forward characteristics fig 2 ?maximum non-repetitive peak forward surge current fig 4 ?typical reverse characteristics fig 5 ?typical junction capacitance t j = 25 c f = 1.0 mhz vsig = 50mvp-p instantaneous forward current (a) junction capacitance (pf) ambient temperature, c number of cycles at 60hz percent of rated peak reverse voltage (%) instantaneous forward voltage (v) reverse voltage (v) 0.375" (9.5mm) lead length 60 hz resistive or inductive load t j = t j max 8.3ms single half sine-wave (jedec method) pulse width = 300 s 1% duty cycle fig 1 ?forward current derating curve instantaneous reverse leakage current ( a) t j = 125 c t j = 25 c t j = 25 c t j = 75 c
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